AP-907 Pentium® III Processor Thermal Design Guidelines

In a system environment, the processor’s temperature is a function of both the system and component thermal characteristics. The system level thermal constraints consist of the local ambient temperature at the processor and the airflow over the processor(s) as well as the physical constraints at and above the processor(s). The processor temperature, measured at various points, depends on the component power dissipation, cartridge size and material (effective thermal conductivity), the type of interconnection to the substrate, the presence of a thermal cooling solution, the thermal conductivity, and the power density of the substrate.

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