Single Edge Contact Connector 2 (S.E.C.C. 2) Thermal Interface Material Functional Requirements
The purpose of the Thermal Interface Material Functional Specification is to provide the design
constraints and requirements for the thermal interface between the Single Edge Contact Cartridge 2
(S.E.C.C. 2) and heat sink to comply with S.E.C.C. 2 performance requirements set by Intel. This
includes environmental testing outlined in Support Component Test Requirements. These
constraints are compatible with the Heat Sink and Heat Sink Attachment Functional Requirements
for S.E.C.C. 2. If the heat sink and S.E.C.C. 2 are not properly attached to one another, the
quality of the thermal interface may degrade, possibly causing damage to the S.E.C.C. 2 processor
or core package.
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